Personal Information
Zhang Hengyun, male, Ph.D, Nanyang Technological University. Professor, School of Mechanical and Production Engineering, Shanghai University of Engineering Science. hyzhangsky@Yahoo.com.
Research Fields
Heat transfer; thermal management
Research Achievements
1. H.Y. Zhang, X.W. Zhang et al, Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers, IEEE Trans. Components, Packaging and Manufacturing Technology 4 (5), 807 – 816, 2014.(SCI/EI)
2. H. Y. Zhang, A General Approach in Evaluating and Optimizing Thermoelectric Coolers, Int. J. Refrigeration 33, 1187–1196，2010. (SCI/EI)
3. H. Y. Zhang, Y. C. Mui, et al, Analysis of TEC performance for electronic packages, Applied Thermal Engineering 30, 561-568, 2010. (SCI/EI)
4. H. Y. Zhang et al, Thermal Characterization and Simulation Study of 2.5D Packages with Multi-Chip Module on Through Silicon Interposer, EPTC 2013. (EI)
5. H. Y. Zhang, YC Mui, et al, Thermal design considerations for system level testing of electronic packages, ICEPT 2010, Xi’An. (Outstanding paper award). (EI)
6. H. Y. Zhang, Y. C. Mui, G. Refai-Ahmed, Thermoelectrics enhanced air cooling limits and improvement techniques: Experimental and computational studies, ITHERM 2010. (EI)