4-year undergraduate program; Bachelor of Engineering
Features: on the background of the advanced electronic manufacturing industry, this Major focuses on the cross-subject clustering of electronic packaging and microelectronics manufacturing, materials science and electrical and electronic engineering, emphasizes the fundamental theories and engineering application abilities related to microelectronics manufacturing and packaging technology and aims to cultivate students into high-quality application-oriented talents who can satisfy the packaging needs for green, large-scale and high-reliability production of advanced electronic components and products.
Main Courses: Circuit, Digital Electronics, Analog Electronics, Introduction to Semiconductor Physics, Materials Science Foundation, Microelectronics Packaging, Electronic Packaging Materials, Semiconductor Device Physics, Semiconductor Manufacturing Technology, Microelectronic Devices Reliability, Optoelectronic Materials and Devices, Material Analysis Methods, other theoretical courses and practical teachings.
Employment Orientation: graduates of this Major may work at electronic packaging enterprises and advanced manufacturing-related electronics enterprises and research departments, and engage in scientific research, technology development, layout design, process improvement and production management and other advanced application work.