School | Course Name | |
14 | Materials Science | Semiconductor Packaging (Microelectronics Encapsulation) |
Course Code | | |
Total Credit Hours | 32 | |
Credits | | |
Lecture Hours | | |
Computer Hours | | |
Experiment Hours | | |
Way of Assessment: Proportion of Result Evaluation: Regular Grades（including result of mid-term exam）40 %+Result of Final Exam 60 % Course Description: This is one of the programming courses for the students majoring in electronic packaging technology. It introduces microelectronic packaging process, in-line quality control and reliability tests. The content consists of process flow, main processing steps (wafer saw, die attach and wire bond), the principles of in-process quality control, and reliability testing. The purpose of the course is to let the students learn the microelectronic packaging process, in-process quality control and reliability tests. Pre-Course: Applicable major: Leading Teachers: Teaching Material: Main Reference Books: | ||