On March 11, SUES played host to the Collaborative Innovation Exchange on Integrated Circuit Analysis and Testing and a visit from the CCF (China Computer Federation) Shanghai Member Activity Center on Songjiang Campus. Li Jiang, Secretary of the CPC SUES Committee and Xu Kaiyu, Vice President of SUES attended the event. Also present were Fang Zhijun, Vice Chairman of the Shanghai Branch of the CCF and Dean of the SUES Artificial Intelligence Industry Research Institute, Ding Yan, Vice Chairman of the Shanghai Branch of the CCF, Lü Jun, Deputy Secretary General of the CCF. More than ten representatives from leading enterprises, including Suzhou Changling Testing Technology Co., Ltd., Heyshine Technology Co., Ltd. (HST), and AVIC Metrology and Testing (Nanjing) Co., Ltd., joined the discussion, engaging in in-depth exchanges on industry-academia collaboration and innovation.
Welcoming the delegation from the CCF and the visiting entrepreneurs, Li Jiang emphasized SUES’ commitment to fostering stronger university-enterprise partnership. He highlighted the University’s ongoing efforts to promote the integration between industry and higher education and build academic programs to tackle real-world business challenges. Li also encouraged seasoned industry experts to impart their knowledge and experience to students, bring vitality to teaching and research. He believed that with joint efforts, a high-level applied engineering university will be forged.
Xu Kaiyu proposed long-term collaboration with enterprises, particularly in talent cultivation and scientific research. She outlined key areas for deepening cooperation, including inviting industry leaders into classrooms, establishing joint internship bases, creating collaborative laboratories, and expanding employment opportunities for students, etc.
Fang Zhijun underscored the importance of aligning academic training with industry needs. He noted that SUES would conduct thorough research on workforce demands and leverage its laboratory resources to co-develop specialized courses with employers. By refining curricula and establishing internship bases for undergraduate and graduate students, SUES aims to cultivate more industry-ready talents.
Ding Yan gave a brief introduction of the Shanghai Branch of the CCF, acknowledging SUES’ solid support and expressing confidence in future collaborations.
Representatives from industry leaders introduced their companies, product advantages, and potential areas of partnership respectively. During the exchange, university leaders and business representatives engaged in productive conversations on topics such as joint research initiatives, collaborative laboratory development, testing platform integration, and the formulation of industry testing standards.
As part of the event, guests toured the University’s Artificial Intelligence Laboratory, Aviation Simulation and Flight Laboratory, and Chip Packaging and Intelligent Manufacturing Laboratory. They caught on the latest research breakthroughs and practical applications, praising SUES for its strong research capabilities and innovative achievements. The success of the exchange has established a solid collaboration platform among the University, enterprises, and academic organizations. It is expected to drive further innovations and technology transfers in IC analysis and testing, contributing to the high-quality development of both the University and the industry.