Program Introduction:It’s a four-year bachelor of engineering degree program. This program is designed to meet the needs of the national strategic deployment plan, belonging to the field of China Chips in the Sino-US trade dispute. Based on advanced microelectronics manufacturing, this program aims to cultivate high-level engineering talents who systematically master the theoretical foundation of interdisciplinary disciplines such as electronic packaging, microelectronics manufacturing, material science, electronic engineering for chip manufacturing, packaging and testing, and large-scale and highly reliable production of electronic devices.
Main Courses: Circuits, Analog Electronics, Digital Electronics, Semiconductor Physics Instructions, Materials Science Basics, Microelectronics Packaging, Electronic Packaging Materials, Semiconductor Devices Physics, Semiconductor Manufacturing Technology, Microelectronics Reliability, MEMS and Microsystems Packaging Basics, Optoelectronic Materials & Devices, Materials Analysis Methods, and other theoretical courses and practical teaching sessions.
Career Outlook: graduates of this program find employment in electronic packaging, microelectronics manufacturing, materials science and engineering, and other related industries (such as communication equipment, computers, network equipment, military electronic equipment, video equipment, and other fields). They are engaged in research and development, manufacturing, quality inspection, production and operation management, etc. Their employment is mainly at large and medium-sized electronic manufacturing enterprises in East China coastal areas.