A team led by Associate Professor Gao Shuang at Shanghai University of Engineering Science (SUES) has long been dedicated to the R&D and innovation of high-end electronic interconnection materials. Targeting the industry bottlenecks in the production of lead-free solder powder, they have successfully developed centrifugal atomization powder equipment and low-temperature alloy solder technology with independent intellectual property rights. This technology significantly enhances the uniformity and oxidation resistance of the solder powder, helping relevant enterprises reduce production costs by 40%, increase product qualification rates to over 80%, and drive an annual increase in output value exceeding 100 million RMB. It provides crucial technical support for achieving import substitution of high-end electronic materials and strengthening the self-reliance and control of the industrial chain.
Team leader Gao Shuang, an Associate Professor and Master's Supervisor, was selected for the 2019 Shanghai Youth Science and Technology Talent Sailing Program and won the Gold Award at the 8th China (Shanghai) International Invention and Innovation Expo. He has successively led 2 enterprise-commissioned projects, participated in 5 General Projects of the National Natural Science Foundation of China, 1 foundational research project of the Shanghai Science and Technology Committee, and 1 project of the Ministry of Industry and Information Technology. In the fields of materials processing and materials science, he has published over 20 papers in high-level journals and has applied for and been granted 5 invention patents. The team has achieved 1 million RMB in technology transfer, leading to an annual increase in enterprise profits exceeding 20 million RMB!
Relying on the Shanghai Class III High-level Discipline platform, the research team from School of Materials Science and Engineering at SUES, led by Gao Shuang, has long focused on systematic innovative research in the development and preparation of high-end electronic interconnection materials. Collaborating with Xiamen Jishiyu Solder Co., Ltd., they have joined forces to tackle key industry challenges. Addressing common issues in traditional centrifugal atomization for solder powder production—such as uneven particle size, low sphericity, susceptibility to oxidation, and solder joint residue—the team innovatively designed a porous rotating cup centrifugal atomization metal powder preparation device and method. They constructed an integrated, intelligent structural equipment system encompassing powder atomization – rapid coarse powder extraction – fine powder pre-separation, successfully bridging the critical link from laboratory R&D to production line application.
Currently, Surface Mount Technology (SMT) is rapidly evolving towards finer pitch, higher density, and lead-free processes. As a core material for interconnecting thermally sensitive components, lead-free solder powder has long faced challenges in China due to inadequate product suitability and difficulty meeting the refined requirements of high-end packaging. Associate Professor Gao Shuang's research team has developed a highly reliable low-temperature alloy solder for microelectronic interconnection, along with its preparation method. This innovation significantly improves the oxidation resistance and particle size concentration of the alloy powder, reducing the need for powder sieving. This method is key to breaching the barriers of the high-end electronic materials market and achieving import substitution. It also promotes the upgrade of China's electronic solder industry towards greater specialization and refinement, strengthens the self-reliance and control of the industrial chain, and solidifies the material foundation for high-quality development in the SMT field.
Core Product - Solder Powder
Core Product - Solder Paste
The project's independently developed integrated, intelligent centrifugal atomization powder processing equipment has been successfully applied in precision manufacturing fields such as integrated circuits and automotive electronics. After applying this technology, the enterprise's product qualification rate increased to over 80%, production costs were reduced by 40%, and the expected increase in output value exceeds 100 million RMB. Related technology patents are currently in the application stage. To date, the team's 6 invention patents/software copyrights (1 transferred) and over 40 high-level papers provide solid technical support for core technological innovation in the equipment and its industrial implementation.
